Dynatex International

Wafer expansion is a critical step to avoid die edge chipping during the pick and place process and shipping. Our DXE wafer expanders provide the next step in the wafer dicing process, expanding the space between diced semiconductor die through omni-directional stretching of the tape on which these die are mounted, while also providing heat to increase the elasticity of the tape.

Learn how our solutions can optimize your wafer expansion process:

http://www.dynatex.com/wafer-expanders_8_115.html