Streuter Fastel Timtel

XoPhase 45 offers high material spread under low pressure and low device operating temperatures. The ability for XoPhase 45 to create a thin phase change layer upon initial flow within these conditions makes it an ideal heat transfer pad solution for thermoelectric modules, heat pipe assemblies, CPU, or clip mount heat sink applications. Designed with a 45C phase change temperature and thermal conductivity of 3.0 W/m-K, XoPhase 45 can be fully customized with respect to a die cut pre-form and film thickness. Learn more: https://www.streuter.com/xophase45-phase-change-thermal-film-pad/

EMI-Phase 60 incorporates the benefits of a thermally conductive phase change coating within a multi-layer pad format that can provide effective EMI shielding properties as well as high-performance heat transfer. EMI-Phase 60 is ideal for a range of power transistor or high frequency packages offering suppression of radiated EMI at its source via a connection to the ground plane. EMI-Phase 60 can be configured with a range of standard and custom outlines, insulation layer types, and conductive copper insert thicknesses. For more information, visit: https://www.streuter.com/emi-shelding-phase-change-thermal-interface-pad/

Need to re-apply phase change thermal compound during device/heat sink rework? Our line of ActaBar 60 and IntraBar 50 phase change compound bars provide you the ability to apply a film-like deposition to your device or heat sink surface in a convenient applicator package. As a dry silicone-free phase change thermal compound, ActaBar and IntraBar both prevent undesirable migration typically found in thermal greases and allow for reliable and high-performance heat transfer. Click here to request a data sheet or sample: https://www.streuter.com/timtel-thermal-interface-materials/phase-change-thermal-compound-bars/