BIWIN

BIWIN

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07/03/2026

BIWIN is excited to connect with industry leaders at FMS 2026, showcasing our latest memory and storage solutions for the enterprise, automotive, industrial, PC OEM, and embedded markets.

Highlights:

👉 SP5002 Enterprise SSD- high-speed, high-capacity E3.S & E1.L enterprise SSD for AI and hyperscale infrastructure, drastically reducing data center rack footprints with up to 61.44TB per single slot and 14,700MB/s read performance in a cost-efficient design.

👉Industrial Storage Solutions
Engineered for harsh and mission-critical environments such as 5G communication infrastructure, our wide-temperature eMMC, LPDDR, and 2.5” SATA / mSATA / M.2 SSDs deliver high endurance, energy efficiency, and long-term lifecycle support.

👉 ePoP5X – With an ultra-thin 0.54 mm profile that reduces PCB area by up to 75%, ePoP5X integrates LPDDR5X + eMMC 5.1 in a single package—offering up to 8,533 MT/s DRAM and 400 MB/s storage, ready to accelerate mass adoption of AI and AR applications.

👉 BL130 Mini SSD – Winner of TIME Best Invention of 2025 and Edison Bronze Awards 2026, achieving 3700/3400 MB/s in a 15.0 x 17.0 x 1.4 mm form.

📍 Booth: Booth #619

📍 Location: Santa Clara Convention Center, California, USA

📅 Dates: Aug 4–6, 2026

06/12/2026

As vehicles become smarter, storage has to keep up—not just in speed, but in reliability, endurance, and power efficiency. 🚗

Meet the BIWIN TAU208 Automotive UFS 3.1, built for the growing data demands of intelligent vehicles, from IVI and smart cockpit systems to HD maps and real-time data streams.

With up to 23.2 Gbps bandwidth, sequential read speeds up to 2,150 MB/s, and write speeds up to 1,650 MB/s, TAU208 helps deliver fast, stable data access where every millisecond matters. ↗️

Engineered for automotive environments, TAU208 supports AEC-Q100 Grade 2 compliance and operates across a wide temperature range of -40°C to +105°C. It also integrates LDPC and RAID technologies, Performance Throttling Notification, Error History logging, and Deep Sleep mode to support long-term system reliability and efficient power management.

Compact, fast, and automotive-ready—TAU208 is designed to help drive the next generation of connected mobility.

đź”— Learn more: https://www.biwintechnology.com/product/tau208-automotive-ufs-3-1/

Photos from BIWIN's post 04/27/2026

In 2025, BIWIN achieved a significant milestone, with annual revenue surpassing 1.65 billion USD, representing a year‑on‑year increase of 68.8%. Profit quality improved significantly – net profit attributable to equity holders more than quadrupled, with basic EPS reaching 1.87 yuan.

Our strategic focus on AI‑driven edge storage continues to pay off. Revenue from AI emerging edge storage products reached 1.75 billion yuan, while our AI glasses storage business contributed approximately 0.96 billion yuan – representing a stunning 378% CAGR from 2023 to 2025.

We also deepened our technology moat. R&D expenses grew 41%, and our R&D headcount expanded by over 40% to 1,262 people – now accounting for 44% of our total workforce. This commitment is reflected in our intellectual property: 521 domestic and international patents (including 217 invention patents) and 66 software copyrights.

On the manufacturing front, we continue to lead in advanced packaging. We have mastered high‑volume capabilities for 16/32‑layer stacked die, 30–40 µm ultra‑thin die, and multi‑chip heterogeneous integration. Our wafer‑level packaging portfolio now covers 2.5D, Chiplet, RDL and Fanout, anchored by our FOMS and CMC product lines.

None of this would be possible without the relentless dedication of our global team. Thank you.

We are entering the AI era with confidence, clarity, and a clear technology roadmap. The best is yet to come.

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