Gel-Pak

With the 2023 Chiplet Summit a little under one week away, what are you looking forward to seeing at the show? Make sure that our R&D Director Dr. Victoria Tran's presentation on micro-textured film for handling 3D devices is on your list! She’s presenting on January 25 at 3:15 PM. Or contact us to set up a meeting at the show! [email protected]

An interesting look at the process of making chips, published by Wall Street Journal. With such a rigorous process combined with the chip shortage, reducing factors that can contribute to yield loss such as improper device transportation is more crucial than ever. Check out the full article here:

There Aren’t Enough Chips — Why Are They So Hard to Make? An upstate New York factory shows the complicated process of turning silicon into a chip.

Chiplets are quickly gaining an incredible amount of traction. According to Verdict, “Module building blocks have moved semiconductor innovation from system-on-chip (SoC) to system-on-package (SoP) chip architectures because the feasibility of implementing complex systems on monolithic dies had reached its physical and economic limits.” We anticipate the accompanying requirements for safe handling and transport will be more essential than ever to protect yields and prevent excess costs. Read more on the rise of here:

Chiplets with everything at the semiconductor cafe Chiplets are on the menu! A ‘chiplet’ is one part of a processing module that makes up a larger integrated circuit like a computer processor.