PHIX Photonics Assembly

Does your PIC design involve ?

Then early choices can have a massive impact on the performance and of the packaged device. PHIX is happy to support!

By incorporating our packaging expertise early, you can achieve high-frequency RF interfaces with:
● Minimal signal reflections and losses
● Close impedance matching of the PIC and PCB
● Feasible and high-performance wire/ribbon bonds

Section 7.11 of our free Design Guidelines for PIC Packaging document will help you understand the basics of RF electrical interfaces, and how PHIX can help you get the most out of them.
➤ Free download here: https://www.phix.com/pic-design-guidelines/

And if our PHIX RF Characterization Package is a good fit for your project, we have even more detailed documentation ready for you.
➤ Learn more here: https://www.phix.com/our-offering/prototype-package/phix-rf-characterization-package/

High-frequency electronics? Let's PHIX it together!

Save big on attending PIC Summit Europe in Eindhoven (NL) with the PHIX partner discount!

With a well-deserved summer break approaching, November may seem far away. But right now you can already take advantage of a 15% discount on your registration for , offered by PHIX as Gold Sponsor of the event.

As one of Europe's premier events on PIC technology, PIC Summit Europe this year focuses on and critical applications for PICs in high-volume markets such as . Its program includes expert keynotes, hands-on breakout sessions, an exhibition, and various networking opportunities.

To claim your discount, apply the code PARTNER15 to your registration.
➤ Scan the QR code or go here: https://www.picsummiteurope.com/RqQewR

We're excited to announce a 30% price reduction* for our PHIX RF Characterization Package!

The high demand for this packaging solution has enabled us to further increase its technology readiness level (TRL) by streamlining our supply chain, stock, and assembly processes.

Furthermore, our efforts toward cost reduction through have been aided by the adoption of assembly design kits (ADKs) by an increasing number of PIC foundries and design software houses.

Lowering packaging costs benefits the entire photonic , accelerating groundbreaking innovations for rapid scaleup toward volume manufacturing!

Visit our website to learn more about this packaging solution and its design rules.
➤ https://www.phix.com/our-offering/prototype-package/phix-rf-characterization-package/

* 𝘈𝘱𝘱𝘭𝘪𝘤𝘢𝘣𝘭𝘦 𝘰𝘯𝘭𝘺 𝘵𝘰 𝘭𝘰𝘸 𝘰𝘳𝘥𝘦𝘳 𝘲𝘶𝘢𝘯𝘵𝘪𝘵𝘪𝘦𝘴 𝘰𝘧 𝘵𝘩𝘦 𝘧𝘶𝘭𝘭𝘺 𝘴𝘵𝘢𝘯𝘥𝘢𝘳𝘥 𝘮𝘰𝘥𝘶𝘭𝘦, 𝘦𝘮𝘱𝘭𝘰𝘺𝘪𝘯𝘨 𝘙𝘍 𝘧𝘢𝘯𝘰𝘶𝘵 𝘣𝘰𝘢𝘳𝘥 𝘰𝘱𝘵𝘪𝘰𝘯 1 𝘰𝘳 2.

Photonics-enabled wireless communication is taking big steps forward!

This module developed as part of the European TERA6G research project combines , advanced , and THz antenna arrays into a unified system, demonstrating a clear path toward terabit-per-second (Tbps) wireless data transmission.

Read our new to learn more about the project's latest developments, the contributions of our consortium partners*, and the exciting applications for this wireless technology!

➤ Blog: https://www.phix.com/advancing-photonic-terahertz-wireless-communication/

* Shootout to our partners: Cumucore, LioniX International, Telefonica, Universidad Carlos III de Madrid, Fraunhofer Heinrich-Hertz Institute, University of Piraeus Research Center, LeapWave Technologies, Institute of Communications & Computer Systems, Oulun Yliopisto, and Intracom Telecom Solutions.

𝘛𝘩𝘪𝘴 𝘸𝘰𝘳𝘬 𝘪𝘴 𝘱𝘢𝘳𝘵 𝘰𝘧 𝘵𝘩𝘦 𝘛𝘌𝘙𝘈6𝘎 𝘱𝘳𝘰𝘫𝘦𝘤𝘵, 𝘸𝘩𝘪𝘤𝘩 𝘩𝘢𝘴 𝘳𝘦𝘤𝘦𝘪𝘷𝘦𝘥 𝘧𝘶𝘯𝘥𝘪𝘯𝘨 𝘧𝘳𝘰𝘮 𝘵𝘩𝘦 𝘌𝘶𝘳𝘰𝘱𝘦𝘢𝘯 𝘜𝘯𝘪𝘰𝘯’𝘴 𝘏𝘰𝘳𝘪𝘻𝘰𝘯 𝘌𝘶𝘳𝘰𝘱𝘦 𝘳𝘦𝘴𝘦𝘢𝘳𝘤𝘩 𝘢𝘯𝘥 𝘪𝘯𝘯𝘰𝘷𝘢𝘵𝘪𝘰𝘯 𝘱𝘳𝘰𝘨𝘳𝘢𝘮 𝘶𝘯𝘥𝘦𝘳 𝘨𝘳𝘢𝘯𝘵 𝘢𝘨𝘳𝘦𝘦𝘮𝘦𝘯𝘵 𝘯𝘰. 101096949.