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The semiconductor industry sees major developments: SkyWater, Coherent, and X-Fab secure funding, TSMC advances 2nm production, and record sales highlight growth. Stricter export rules and China's material restrictions reshape global trade, while CHIPSAct funding withdrawals spark debate. Intel adds new board members, and the latest CXL spec drives innovation.

Source: Semiconductor Engineering

Chip Industry Week In Review TSMC readies 2nm; record semiconductor sales; stronger export rules; China's materials retaliation; CHIPS Act funding withdrawal, new awards; Intel board additions; new CXL spec.

Growing complexity is altering how businesses connect and engage, but progress is being slowed by ingrained obstacles in IP protection, culture, and communication.
Semiconductor Engineering

Advanced Packaging Driving New Collaboration Across Supply Chain Rising complexity is changing the way companies engage and interact, but long-standing barriers in communication, culture, and IP protection are slowing progress.

This week in semiconductors: Amkor-TSMC strike a major deal, new legislation fast-tracks semiconductor projects, NSTC officially launched, and the latest on quartz supply. Plus, updates on chiplet partitioning, semiconductor materials, ferroelectric devices, and power demands in data centers. Insights into data routing in heterogeneous chip designs and Rapidus expands its build-out plans. For full details, Semiconductor Engineering
https://semiengineering.com/chip-industry-week-in-review-55/

Chip Industry Week In Review Amkor-TSMC deal; new law speeds semiconductor projects; NSTC launch; quartz supply; chiplet partitioning; semiconductor materials; ferroelectric devices; data center power; data routing in heterogeneous chip designs.

Major semiconductor news this week! Highlights include Google's AlphaChip, 300mm fab investments, TSMC partnerships, CXL memory, India's fab development, and more!

Chip Industry Week In Review Google's AlphaChip; 300mm fab equip spending; TSMC-EDA partnerships; $123M CHIPS Act; CXL memory standards; MIPI's A-PHY v2.0; 12-stack HBM3E; LLMs for chip design and manufacturing; CHIPS Metrology access.