Heatconduction.com

HC series double-sided heat-conducting adhesive is a kind of heatconducting material used for bonding heat sink and other power
consuming semiconductors. It has the characteristics of high heat
conduction and insulation, as well as the characteristics of softness,
compressibility, adherence, strong viscosity and small thermal
impedance.It can effectively replace thermal silicon grease and
mechanical fixation.👏👏👏

single compoment thermal conductive silica gel

It IS FILLED BETWEEN the electronic component to be cooled and the radiator/housing to make close contact, reduce the thermal resistance, quickly and effectively reduce the temperature of the electronic component