Electronics MDPI

🥁 Big news for —we’re thrilled to reveal that Prof. Dr. Danqing Liu, from TU Eindhoven, is our second Plenary Speaker! 🌷

📚 With her broad background in various disciplines (electrical, mechanical, and chemical engineering), Prof. Liu develops materials that sense, feel, and communicate with humans or machines. 📡

🎓 Shortly before joining the TU/e Chemical Engineering and Chemistry department, she also received the Michi Nakata Prize for Early Career Achievements from the International Liquid Crystal Society. 💎

https://brnw.ch/21x2SFa 🔗 Join her from 16–18 September for the 6th International Conference on Materials: From Innovation to Translation. Submit your abstract to be in for actionable insights and long-lasting collaborations! 🤝

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📡A Review of Multifunctional Antenna Designs for Internet of Things
🔗Read at: https://shorturl.at/xvU7V

Authors: Dimitrios G. Arnaoutoglou, Tzichat M. Empliouk, Theodoros N. F. Kaifas, Michael T. Chryssomallis and George Kyriacou from Democritus University of Thrace

In this review, a comprehensive analysis of antennas is conducted based on their application characteristics. It is important to note that, to the best of our knowledge, this is the first time that this categorization has been performed in the literature. Indeed, comparing IoT antennas across different applications without considering their specific operational contexts is not practical. This review focuses on four primary operational fields: smart homes, smart cities, and biomedical and implantable devices.

A Review of Multifunctional Antenna Designs for Internet of Things The Internet of Things (IoT) envisions the interconnection of all electronic devices, ushering in a new technological era. IoT and 5G technology are linked, complementing each other in a manner that significantly enhances their impact. As sensors become increasingly embedded in our daily lives, they...

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📡A Survey of NOMA-Aided Cell-Free Massive Systems
🔗Read at: https://www.mdpi.com/2079-9292/13/1/231
Authors: Antonio Apiyo and Jacek Izydorczyk

The Internet of Everything is leading to an increasingly connected intelligent digital world. Envisaged sixth-generation wireless networks require new solutions and technologies due to stringent network requirements. The benefits of cell-free massive MIMO (CF-mMIMO) and non-orthogonal multiple access (NOMA) have brought substantial attention to these approaches as potential technologies for future networks. This paper provides a comprehensive review and survey of NOMA-aided CF-mMIMO (CF-mMIMO-NOMA). Specifically, we present a comprehensive review of massive MIMO, CF-mMIMO, and NOMA. We then present a state-of-the-art research review of CF-mMIMO-NOMA. Finally, we discuss the challenges and potential of combining CF-mMIMO-NOMA with other enabling technologies to enhance performance.

A Survey of NOMA-Aided Cell-Free Massive MIMO Systems The Internet of Everything is leading to an increasingly connected intelligent digital world. Envisaged sixth-generation wireless networks require new solutions and technologies due to stringent network requirements. The benefits of cell-free massive MIMO (CF-mMIMO) and non-orthogonal multiple acces...

📢Meet Us at the 39th Electric Vehicle Symposium & Exhibition ( )!
📅Mark Your Calendar: 21–24 June 2026
📍 Location: Long Beach, California, USA
🏚️Booth #625
🔗More Info: https://www.mdpi.com/about/announcements/15915

Electronics MDPI is pleased to announce our participation in the 39th Electric Vehicle Symposium & Exhibition, which will be held from 21 to 24 June 2026, in Long Beach, California, USA. Organized and hosted by the Electric Drive Transportation Association (EDTA), the 39th Electric Vehicle Symposium and Exhibition (EVS39) is the premier showcase for industry innovation and is the longest-running international conference devoted to electric transportation and technologies.

The series began in 1969 as an academic forum for global networking and the exchange of technical information. As electric drive technologies progressed from classrooms and laboratories to the marketplace, the EVS expanded into both an academic and business-oriented event.

📔 in Electronics!
⚡🔋 Voltage Level Compensation Method for Post-Fault Operation of Modular Multilevel with Integrated
🔗Read at: https://www.mdpi.com/2079-9292/15/10/2034
Authors: Rok Friš and Mitja Truntič
This paper presents a voltage compensation algorithm as an addition to the existing improved sorting algorithm for post-fault operation of a modular multilevel converter with integrated batteries, aimed at electric vehicle applications. The work focuses on improving the performance of the sorting algorithm that allows the converter to continue operating without degradation after one transistor fault, by using the faulted module in half-bridge mode while preserving access to its battery. However, the existing sorting algorithm has a limitation during continuous high-power operation, where the faulted module cannot discharge sufficiently. This results in a voltage imbalance between the modules and distortion of the output current waveform. To address this issue, a voltage level compensation algorithm is proposed, which adjusts the module operational limits and the reference signal amplitude based on the measured module voltages. The method compensates the positive and negative half-periods of the output waveform independently, since different modules are active in each half-period during fault conditions.

Voltage Level Compensation Method for Post-Fault Operation of Modular Multilevel Converter with Integrated Battery This paper presents a voltage compensation algorithm as an addition to the existing improved sorting algorithm for post-fault operation of a modular multilevel converter with integrated batteries, aimed at electric vehicle applications. The work focuses on improving the performance of the sorting al...

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💻Optimizing Confined Nitride Trap Layers for Improved Z-Interference in 3D NAND Flash Memory
🔗Read at: https://www.mdpi.com/2079-9292/13/6/1020

Authors: Yeeun Kim, Seul Ki Hong and Jong Kyung Park from Seoul National University of Science and Technology

This paper presents an innovative approach to alleviate Z-interference in 3D NAND flash memory by proposing an optimized confined nitride trap layer structure. Z-interference poses a significant challenge in 3D NAND flash memory, especially with the reduction in cell spacing to accommodate an increased number of vertically stacked 3D NAND flash memories. While the confined nitride trap layer device designed for complete isolation of the trapping layer in three dimensions effectively reduces Z-interference, the results showed substantial variations based on the confined structure. To clarify this issue, we compared three distinct confined nitride trap layer structures and investigated their impact on Z-interference. Our findings indicate that the rectangle structure exhibited the most significant mitigation, implying that differences in the electric field applied to the poly silicon channel, which is influenced by the structure, and the increase in effective channel length are effective strategies for alleviating Z-interference. The proposed structure undergoes a comprehensive examination through technology computer-aided design (hashtag ) simulations. Additionally, we introduce a practical process flow designed to minimize Z-interference.

Optimizing Confined Nitride Trap Layers for Improved Z-Interference in 3D NAND Flash Memory This paper presents an innovative approach to alleviate Z-interference in 3D NAND flash memory by proposing an optimized confined nitride trap layer structure. Z-interference poses a significant challenge in 3D NAND flash memory, especially with the reduction in cell spacing to accommodate an increa...

📢 👏 All articles in Electronics, Volume 15, Issue 9 (May-1 2026), are now freely available to access, read and download!
👉 Check out the Issue here: https://www.mdpi.com/2079-9292/15/9
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📝Cover Paper: Building Aerial Corridors for 6G Sky Infrastructure
👉 View cover paper: https://www.mdpi.com/2079-9292/15/9/1773
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📔 We usually choose representative articles for Issue Cover, and authors are welcome to recommend articles that are processing in Electronics MDPI for Issue Cover. If you are interested in this project, please contact 📩 [email protected] directly.

🤝Last Day at the 2026 IEEE International Symposium on Circuits and Systems ( 2026)!
📅 When: 24–27 May 2026
📍 Where: Shanghai, China
🏢 Booth:
🔗 More Info: https://www.mdpi.com/about/announcements/16333

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the hashtag Circuits and Systems Society and the world’s premier forum for researchers in the active fields of theory, design and implementation of circuits and systems. ISCAS 2026 is driven by the theme “Circuits and Systems for Intelligent Society”, catalyzing transformative innovation at the intersection of circuits, systems, and artificial intelligence to faster the development of a smart and sustainable society.

📢Meet Us at the 17th IEEE International Conference on Electron Devices and Solid-State Circuits ( 2026)
📅Mark Your Calendar: 9–12 June 2026
📍 Location: Guangzhou, China
🔗More Info: https://www.ieee-edssc.org/

is the 17th in a series of highly successful conferences initiated by the ED/SSC Beijing Section Hong Kong Chapter and is hosted by South China University of Technology. The conference continues the EDSSC tradition as a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the broad areas of electron devices and solid-state circuits and systems.

In a career? Good news! With escalating interest and responses, we're pleased to share that has a new Abstract Submission Deadline—30 June 2026. ⌚

👉 Discover more and submit your abstract here: https://brnw.ch/21x2Hoi

Showcase your stellar work to industry professionals and experts in the field, at a far-reaching event in dazzling ! ⚽

💡 If your submission is nearly there or your just needs a bit more time before sharing it with the public, jump on this final chance to present, connect, and ready for the future of this academic community.